Business Overview

Electronics Business

Business Overview

ProductsMain products

Bonded wafers delivering a level of performance and functionality that cannot be achieved with wafers made from a single material

Beryllium copper that improves reliability of electronic devices and realizes miniaturization

Translucent HICERAM alumina ceramics used as element substrates for LED devices

Ceramic packages for high-frequency devices that hold the world's top market share

Electronic components for communication devices such as multilayered dielectric filters and couplers

Bonded Wafers for SAW FiltersThat Enhance Communication Quality for Smartphones and Other Devices

While conventional SAW (Surface Acoustic Wave) filters suffer from the disadvantage of being susceptible to a high degree of expansion and contraction based on temperature, NGK's bonded wafers realize a significant reduction in thermal expansion, thus offering solutions for next-generation LTE that require filtering functions with higher precision.

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