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AMB Substrates for Power Modules
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Overview
Active Metal Brazing (AMB) substrates for Power Modules enable efficient and stable operation in inverter control devices, releasing the heat which is generated by the built-in power semiconductor.
Features
AMB Substrates for Power Modules are products in which copper plates are bonded to each surface of a ceramic plate, which is an insulating material.
We offer Silicon Nitride-based ceramic materials.
Through bonding by the AMB method, the Silicon Nitride-based ceramic plate is integrated with the copper plate.
Those products are characterized by a high thermal conductivity and a high electric conductivity of copper, and also a high insulation property of ceramic substrate.
In the AMB method, a bonding layer with a thickness of several microns or less is achieved, the advantage being there is almost no effect on thermal resistance.
Application
- Various power modules in which power semiconductor chips, such as Si-IGBT and SiC-MOSFET, are mounted
- Power module units for electric vehicles
- Renewable energies (wind power, photo voltaic power generation, etc.)
- Inverters for industrial use
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