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Bonded wafers delivering a level of performance and functionality that cannot be achieved with wafers made from a single material
Beryllium copper that improves reliability of electronic devices and realizes miniaturization
Translucent HICERAM alumina ceramics used as element substrates for LED devices
Ceramic packages for high-frequency devices that hold the world's top market share
Electronic components for communication devices such as multilayered dielectric filters and couplers
Bonded Wafers for SAW FiltersThat Enhance Communication Quality for Smartphones and Other Devices
While conventional SAW (Surface Acoustic Wave) filters suffer from the disadvantage of being susceptible to a high degree of expansion and contraction based on temperature, NGK's bonded wafers realize a significant reduction in thermal expansion, thus offering solutions for next-generation LTE that require filtering functions with higher precision.