Products
HICERAM Wafer
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Overview
NGK's HICERAM Wafer consists of 99.99% high purity alumina, enabling translucency, high insulation, and high strength. Large sizes (up to 12 inch) and variant shapes using NGK's original Mold-cast forming are available.
Application
Support Wafer (W/ or w/o Through Vias)
Superior translucency, thermal conductivity and stiffness
- Superior chemical resistance by high purity
- The high degree of arrangement of through vias on the HICERAM wafer is provided by applying mold casting.
- Size available up to φ300mm or 300mm
- High transparency, UV to IR
- High strength equivalent to sapphire.
Interposer substrate
Thin core material for package substate for superior stiffness and low dielectric loss
Setter for firing
- High purity, does not stain the inside of the furnace
- Space saving in the furnace available by thin setter.
- Infrared transmission, enabling uniform firing and improve firing efficiency.
Other applications
HICERAM material suitable for components and tools requiring high strength and chemical resistance. (HICERAM is superior to sapphire in availability of large sizes and various shapes)
Inquiry about Electronic Components
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