Temporary Support Wafer


NGK suggests use of HICERAM Wafer as a process retaining support of ultrathin or fragile device wafers.


  • Possible usage; flat surface wafer, Via Wafer and so on.
  • Possible support applications; UV detachment, thermal detachment and so on.
  • High chemical resistance; detaches chemical such as acid and alkali

Comparison of Material Properties

HICERAMGlass (quartz)Si
Separate methodThermal Excellent Good Excellent
UV Excellent Excellent -
Chemical Excellent Fair Fair
Young´s modulus ( GPa ) 410 72 185
Thermal Conductivity ( W/mK ) 34 1 168

Possible Applications

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