Products

HTCC Related Proprietary Technology

High strength material technology

Alumina materials strength vs Dielectric constant

Alumina materials strength vs Dielectric constant

Features

  • High-strength materials by particulateing

Application example

  • Small and low-height / high heat dissipation ceramic package

Small and low height ceramic package

Small and low height ceramic package

Sintering control technology

Firing shrinkage control of alumina and metallization (example)

Firing shrinkage control of alumina and metallization (example)

Features

  • Shrinkage control technology by design optimization of inorganic/organic composition

Application Example

  • High flatness/ camber reduction and high dimensional accuracy product

Advantage of sealing by high flatness and camber reduction (example)

Advantage of sealing by high flatness and camber reduction (example)

1. In the case of seam sealing
The amount  of camber become smaller, and it  is advantageous for crack controls.

2. In the case of AuSu sealing
The amount of Au usage can be reduced by high flatness
on the surface of sealing area.

Multilayer wiring technology

Fine wiring (example)

Surface

Line/Space:40/30μm
Line/Space:40/30μm
Line/Space:50/30μm
Line/Space:50/30μm
Line/Space:60/30μm
Line/Space:60/30μm

Multilayer wiring (Example)

Cross section

Cross section

Features

  • Multilayer wiring by material technology and high-precision process technology

Application example

  • High-density wiring product: small/highly integrated component

Technology for bonding of different materials

Composition of bonded product of different materials (example)

Composition of bonded product of different materials (example)

Bonding material (example)

Bonding material (example)

Feature

  • It realizes bonding metal material of various complicated shape with high heat dissipation materials as well as general purpose metal material.

Application example

  • Optical communication / high heat dissipation product

Design technology

Simulation technology

Simulation Evaluation categories
Electromagnetic field

- S parameters: pass, reflect, crosstalk

- Characteristic impedance

- LCR equivalent circuit

Stress distribution - Destructive life
- Destructive stress
Heat diffusion - Thermal resistance
- Temperature distribution

Features

  • The following proposals are possible with simulation technology.
  1. High-frequency characteristics
  2. Highly reliable structure
  3. High heat dissipation structure

Application example

  • Various ceramic package product

Plating technology

Plating available

Plating How to apply
Electrolytic plating Ni plating Au plating as base plating
Au plating Wire bonding, soldering, soft Au plating
Pd Plating Au Alternative for Au/Pd Plating
Electroless plating Ni-B soldering Base Ni plating on brazing area
Ni-P Au as base plating
Au Wire bonding, soldering, soft Au plating

Example

Example
Example

Features

  • It can be mountable with corrosion resistance by various plating film.

Application example

  • Various ceramic package product

Inquiry about Electronics Business

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