Ceramic package with built in semiconductor contribute electronics evolution of wideband communication speed in the future as well as miniaturization and high functionality.
1. In the case of seam sealing
The amount of camber become smaller, and it is advantageous for crack controls.
2. In the case of AuSu sealing
The amount of Au usage can be reduced by high flatness
on the surface of sealing area.
- S parameters: pass, reflect, crosstalk
- Characteristic impedance
- LCR equivalent circuit
|Stress distribution||- Destructive life|
|- Destructive stress|
|Heat diffusion||- Thermal resistance|
|- Temperature distribution|
|Plating||How to apply|
|Electrolytic plating||Ni plating||Au plating as base plating|
|Au plating||Wire bonding, soldering, soft Au plating|
|Pd Plating||Au Alternative for Au/Pd Plating|
|Electroless plating||Ni-B soldering||Base Ni plating on brazing area|
|Ni-P||Au as base plating|
|Au||Wire bonding, soldering, soft Au plating|
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