HTCC
Ceramic package with built in semiconductor contribute electronics evolution of wideband communication speed in the future as well as miniaturization and high functionality.
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HTCC Related Proprietary Technology
Product tags：
High strength material technology
Alumina materials strength vs Dielectric constant
Features
- High-strength materials by particulateing
Application example
- Small and low-height / high heat dissipation ceramic package
Small and low height ceramic package
Sintering control technology
Firing shrinkage control of alumina and metallization (example)
Features
- Shrinkage control technology by design optimization of inorganic/organic composition
Application Example
- High flatness/ camber reduction and high dimensional accuracy product
Advantage of sealing by high flatness and camber reduction (example)
1. In the case of seam sealing
The amount of camber become smaller, and it is advantageous for crack controls.
2. In the case of AuSu sealing
The amount of Au usage can be reduced by high flatness
on the surface of sealing area.
Multilayer wiring technology
Fine wiring (example)
Surface
Multilayer wiring (Example)
Cross section
Features
- Multilayer wiring by material technology and high-precision process technology
Application example
- High-density wiring product: small/highly integrated component
Technology for bonding of different materials
Composition of bonded product of different materials (example)
Bonding material (example)
Feature
- It realizes bonding metal material of various complicated shape with high heat dissipation materials as well as general purpose metal material.
Application example
- Optical communication / high heat dissipation product
Design technology
Simulation technology
| Simulation | Evaluation categories |
|---|---|
| Electromagnetic field |
- S parameters: pass, reflect, crosstalk - Characteristic impedance - LCR equivalent circuit |
| Stress distribution | - Destructive life |
| - Destructive stress | |
| Heat diffusion | - Thermal resistance |
| - Temperature distribution |
Features
- The following proposals are possible with simulation technology.
- High-frequency characteristics
- Highly reliable structure
- High heat dissipation structure
Application example
- Various ceramic package product
Plating technology
Plating available
| Plating | How to apply | |
|---|---|---|
| Electrolytic plating | Ni plating | Au plating as base plating |
| Au plating | Wire bonding, soldering, soft Au plating | |
| Pd Plating | Au Alternative for Au/Pd Plating | |
| Electroless plating | Ni-B soldering | Base Ni plating on brazing area |
| Ni-P | Au as base plating | |
| Au | Wire bonding, soldering, soft Au plating | |
Example
Features
- It can be mountable with corrosion resistance by various plating film.
Application example
- Various ceramic package product
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