Bonded Wafer for SAW Filter Application


With its precise polishing and wafer bonding technology, NGK offers wafers for SAW filters.

  • By bonding silicon that has low thermal expansion and high quality single crystal piezoelectric substrate, we make it possible to improve thermal behavior without affecting its function.
  • With NGK's polishing technology, thickness of piezoelectric layer can be adjusted with high precision.
  • Size is available up to 6 inch.
Bonded Wafer for SAW Filter Application

The difference between conventional saw filter and bonded wafer


  • By bonding Silicon and Piezoelectric Material, piezoelectric material is able to function without effect from heat.
  • NGK earns high credibility with its original bonding technology.

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