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Bonded Wafer for SAW Filter Application
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Overview
With its precise polishing and wafer bonding technology, NGK offers wafers for SAW filters.
- By bonding silicon that has low thermal expansion and high quality single crystal piezoelectric substrate, we make it possible to improve thermal behavior without affecting its function.
- With NGK's polishing technology, thickness of piezoelectric layer can be adjusted with high precision.
- Size is available up to 6 inch.
Properties
- By bonding Silicon and Piezoelectric Material, piezoelectric material is able to function without effect from heat.
- NGK earns high credibility with its original bonding technology.
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